芯智雲城

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APT7L05
图片仅供参考

THGBM5G5A1JBAIR

厂商:
TOSHIBA
类别:
eMMC
封装:
P-VFBGA153-1113-0.50-002
包装:
-
最小包装量:
760
最小起订量:
760
无铅情况/ROHS:
无铅
数    量:
760*
- +
=760
温馨提示:建议拍下数量是最小包装量的整数倍。
THGBM5G5A1JBAIR is 4-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBM5G5A1JBAIR has an industry standard MMC protocol for easy use.