- 您好 欢迎光临芯智雲城!
THGBM5G5A1JBAIR is 4-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBM5G5A1JBAIR has an industry standard MMC protocol for easy use.